Mechanical 3D Modelling offers high quality and low cost thermal analysis services in CFD. We also provides CFD simulation, CFD Modeling and CFD Consulting Services to across the globe.
The rapid development of the integrated circuits industry has provided greater benefits and helped in solving the various complex engineering cases. With the integration of complex systems on a single system on a Chip (SoC) module, the hardware design aspect of the engineering processes has shown a significant reformation.
However, with the increase in compactness of the designs, some challenges are also emerging on the way. Some of the discrepancies that should be given a deep technical thought are the increased power consumption, increase in the inconsistency of the parameters and generation of heat.
Efficient thermal analysis of the VLSI chips is the need of the hour so that the various issues related to the chip design and functioning can be solved easily. It has been found that approximately 50 % of the failures which happen in the integrated circuits are related to the generation of heat. Due to the smaller chip sizes, there is an increase in the power density and the integration density, and the internal temperature of the circuits increase during the working. To control the internal temperature and to find out ways to dissipate the heat, accurate thermal analysis of the integrated circuits is necessary.
Some of the parameters which can effectively be calculated using thermal analysis are:
• Distribution quotient of the transient temperature.
• Power consumption.
• Chip internal temperature.
• Functional relationship between temperature and density.
• Acceptable scaling limits of the chip designs.
In the traditional thermal analysis methods of the VLSI chips, various sensors were being placed on different locations of the chips so as to record the voltage and compare it with the reference chip voltage, so as to reduce the chances of overheating. But this is a limited approach, as the voltages of only the specific locations on the chips can be recorded and comprehensive results cannot be found out.
In order to monitor the thermal stress experienced by all the sections of the large scale integrated chips, an algorithm based thermal analysis method would be more effective. The latest heat calculation techniques encompass different techniques such as the finite element method (FEM), gradient direction sensors (GDS) method, and implementation of the surface peaks thermal detector algorithm (SPTDA).
To get more details, please visit at http://www.mechanical3dmodelling.com/cfd-analysis-services.php
To discuss your project requirement, email us at [email protected]
Posted by Prahlad Parmar – Engineering Consultant at Mechanical 3D Modelling.
However, with the increase in compactness of the designs, some challenges are also emerging on the way. Some of the discrepancies that should be given a deep technical thought are the increased power consumption, increase in the inconsistency of the parameters and generation of heat.
Efficient thermal analysis of the VLSI chips is the need of the hour so that the various issues related to the chip design and functioning can be solved easily. It has been found that approximately 50 % of the failures which happen in the integrated circuits are related to the generation of heat. Due to the smaller chip sizes, there is an increase in the power density and the integration density, and the internal temperature of the circuits increase during the working. To control the internal temperature and to find out ways to dissipate the heat, accurate thermal analysis of the integrated circuits is necessary.
Some of the parameters which can effectively be calculated using thermal analysis are:
• Distribution quotient of the transient temperature.
• Power consumption.
• Chip internal temperature.
• Functional relationship between temperature and density.
• Acceptable scaling limits of the chip designs.
In the traditional thermal analysis methods of the VLSI chips, various sensors were being placed on different locations of the chips so as to record the voltage and compare it with the reference chip voltage, so as to reduce the chances of overheating. But this is a limited approach, as the voltages of only the specific locations on the chips can be recorded and comprehensive results cannot be found out.
In order to monitor the thermal stress experienced by all the sections of the large scale integrated chips, an algorithm based thermal analysis method would be more effective. The latest heat calculation techniques encompass different techniques such as the finite element method (FEM), gradient direction sensors (GDS) method, and implementation of the surface peaks thermal detector algorithm (SPTDA).
To get more details, please visit at http://www.mechanical3dmodelling.com/cfd-analysis-services.php
To discuss your project requirement, email us at [email protected]
Posted by Prahlad Parmar – Engineering Consultant at Mechanical 3D Modelling.